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IDT-TAF

처음으로 > 제품소개 > IDT-TAF series

IDT-TAF series  -  Thermal  Acrylic Foam Tape

제품특징

  • 우수한 수직열전도율
  • 얇고 /유연한 속성에 따라 여러분야에 적용
  • 뛰어난 점착력 및 신뢰성(반복 압축)
  • 재작업시 품질이 우수함
  • 난연성

제품적용

  • Bonding heat sink for PCB and IC package
  • Mounting of IC, GPU, heat pipe and heat sink during assembly
  • Bonding heat sink on PCB(metal or FR4) for LED package

구조

  • Thermal Acrylic Foam adhesive
  • Reinforcement fabric
  • Insulated layer
  • Release Film

제품사양

IDT-TAF series 사양
Item IDT-TAF Reference
Content
Thickness (mm) 0.15, 0.20, 0.25 ±10%
Adhesive Strength
(180 º peel, gf/25mm)
Min. 1,500 KS T 1028/SUS Plate
Thermal Conductivity (W/m·K) 1.0 ASTM E 1461
Density (g/cm3 ) 1.85
Holding Power Less than 1.0 25mm x 25mm, 60℃, 1kg
Temp. Range -20 ~ 105
Flammability V0 UL94
RoHS & Halogen Free N.D

주문방법

P/N:IDT - 1.TAF – 2.AAA - 3.BBB - 4.CCC

  1. Serial Number
  2. Thickness (mm) : Adhesive layer is included. EX) 020means 0.20mm
  3. Width (mm)
  4. Length (mm)