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Conductive Paste

Home > Products > Conductive Paste

Conductive Paste

Introduction

  • Doo Sung has developed conductive paste that is designed to provide EMI/RFI shielding on the insulation substrates. Doo Sung ’s conductive paste is composed of high electric conductive silver filler. This product is formulated in low VOC that can prevent sensitive substrates such as polycarbonate (PC) to solvent.

Features

  • Excellent Shielding Performance
  • Excellent Adhesive Characteristics to most Plastic Substrate (especially PC and PC alloys)
  • Low Resistivity at thin Film Build
  • Excellent Film Cohesion
  • Sprayable and Brushable in Applications

Applications

  • Mobile Phones
  • RF Amplifier Modules
  • Automobile Applications
  • Medical Equipments
  • Test Instruments, Monitors
  • Industrial / Auto Control System
  • Antennas
  • Computer Peripherals
  • Military Equipments

Specifications

Conductive Paste Specifications
Content IDP-01S
Specification IDP-01S Specification IDP-01S Specification
Properties Resin Polyurethane
Filler Silver
System Solvent-based
Solid Content 46.0 ± 1.5 wt%
Specific Gravity 1.40 ± 0.05
Viscosity 14.0 ± 2.0 sec
Characteristics Recommended Thickness 12.5㎛ (Dry film)
Volume Resistivity Max. 10×10-5 Ω·cm
Shielding Effectiveness Min. 70 dB [30MHz~1GHz]
Diluent EtOH, Acetone
(Especially, EtOH : paste=1 : 1 at volume ratio is recommended)
Drying Time 15 min at 60℃
Shelf Life (unopened) 6 months