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IDflexink series

Home > Products > IDflexink series

IDflexink series - Thin HeatSink type

Features

  • There are requirements for applying thermal absorbing and conduction system to electronic appliance because of temperature increasing from miniaturization, high speed, and integration.
  • Increasing effects of thermal absorbing and conduction using metal film coated ceramic have insulation, absorbing, and conduction property.
  • This can replace normal graphite sheet.
  • It is easy to make various shapes, and has good competitive price

Structure

  • Cu type
  • Al type
  • Ceramic Coating
  • Electrolysis copper
  • Aluminum
  • Non-Carrier Thermal
    Adhesive Tape

Specifications

IDflexink series Specifications
Standard Specifications Test Method
Material Inorganic oxidized powder + H2O
Color Black Visual
Thickness (mm) Ceramic Coating : 15㎛
알루미늄(Al)박: 25,40,70,120㎛
동(Cu)박 : 35㎛
Standard size 210 x 300mm (Sheet)
Vertical Thermal Conductivity(W/m·K) C type Min. 1.0 ASTM E 1461
A type Min. 1.5
Horizontal Thermal Conductivity(W/m·K) C type Min. 160
A type Min. 130
Heat Dissipation 0.891 KICM-FIR-1005 : 2006
Voltage Breakdown (KV/mm) Min. 1000 180° peel / SUS304 plate

How to Order

P/N:1.IDflexink - 2.AAA - 3.BBB - 4.CCC - 5.DDD - 6.EEE

  1. Serial Number
  2. Thickness (mm) - Adhesive not included, only thickness of Metal film & Ceramic coating : 015 means 0.15mm
  3. Type : A (Al), C (Electrolysis Copper)
  4. Width (mm)
  5. Length (mm)
  6. Adhesive Tape Type : Non-Carrier Thermal Adhesive Tape